![COM Express MODULE with Intel Core 2 Duo 2.26Ghz,DDR3 2GB Memory, Heatsink with Fan 5324556-3-R COM Express MODULE with Intel Core 2 Duo 2.26Ghz,DDR3 2GB Memory, Heatsink with Fan 5324556-3-R](/medias/5324556-3-r-T1.jpg?context=bWFzdGVyfGltYWdlc3w2NjQyMjF8aW1hZ2UvanBlZ3xhVzFoWjJWekwyZzNPQzlvWlRJdk9EZzFOekExT0RVM05ETTJOaTVxY0djfDcwMTNmYWVlYTU5Nzk5ZjNiZWM4ZDQ0MTkzOGJiM2IyOGQwM2MwMGUzNWJkOGViNWQ3ZDY4MWQ4MDNhMjg2YzY)
COM Express MODULE with Intel Core 2 Duo 2.26Ghz,DDR3 2GB Memory, Heatsink with Fan 5324556-3-R
5324556-3-R | |
Ultrasound | |
Other Ultrasound | |
GE HealthCare | Exchange - Return Defective |
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Features
- Field Replaceable Unit (FRU)
- Fast processing power
- High data transmission
- Compatible with many machines
Product Overview
A Computer-On-Module (COM) is a complete embedded computer built on a single circuit board. The design is centered on a microprocessor with RAM, input/output controllers and all other features needed to be a functional computer on one board. This Computer-On-Module (COM) consists of an Intel Core™ 2 Duo P8400 processor clocked at 2.26 GHz with a 3 MB L2 Cache, 1066 MHz Front Side Bus, 2 GB DDR3 RAM which is expandable up to 8 GB, Intel GM45 and Intel ICH9M-E chipset and high defintion audio support with multiple CODEC. The board comes with 3 serial ATA (Advanced Technology Attachment), 5x PCI Express™ lanes, PCI Express Graphics (PEG), flashable BIOS, 8 USB 2.0, an Enhanced IDE (EIDE), I²C Bus, and LPC Bus pheripheral interfaces. It also includes a CPU fan and a heat sink to control the CPU temperature. The module is an Advanced Configuration and Power Interface (ACPI) 3.0 Compliant with battery support. This Computer-On-Module (COM) can be used with Voluson S6 and Voluson S8 Ultrasound systems. 5324556-3-R